Best Student Paper Award Short Course Program Technical Program Committees Call For Papers


2013 SYMPOSIUM ON VLSI CIRCUITS

2013 VLSI Circuits Short Course Program

"Device-Aware Circuit Design in the Era of Disruptive Changes"

Tuesday, June 11, 2013

Organizers/Chairs:
Seonghwan Cho, KAIST
Jeyanandh Paramesh, CMU
Room:
Suzaku I

Introduction of new materials and new transistor structures in advanced technology nodes will further increase the ever-rising complexity of circuit design flow and design rules. The rocketing R&D expense and wafer-cost, on the other hand, will limit the number of active fab players. The aim of this Short Course is to present circuit designers aspects of advanced technology nodes that one must be aware of in designing circuits in a hierarchical way. Special focus will be put on design flow integration and total design flow management.

8:20-8:30
Introduction
8:30-9:30 Advanced CMOS Technologies
S. -H. Lee, SK Hynix
9:30-10:30 Discrete-Charge-Induced Variability in MOS Transistors
Kiyoshi Takeuchi, Renesas
10:30-10:45 Break
10:45-11:45 Impact of Technology on Digital Design
Dinesh Somasekhar, Intel
11:45-11:50 Additional Q&A on Morning Talks
11:50-13:40 Lunch
13:40-14:40 Advanced Wireline Transceivers in the Era of Disruptive Changes            
Ichiro Fujimori, Broadcom
14:40-15:40 Foundry Based IC Design in Advanced Technology
Kimihiko Imura, Maxlinear
15:40-15:55 Break
15:55-16:55 Device-Aware Design Flow Management
Pierre Dautriche, STMicroelectronics
16:55-17:00 Additional Q&A on Afternoon Talks
17:00 Conclusion


2013 VLSI Circuits Workshop Program

"Non-Volatility and 3D-Ability: Empowering LSI-based Smart Systems of Tomorrow"

Tuesday, June 11, 2013

Organizers/Chairs:
Jun Terada, NTT
Mark Bauer, MICRON
Room:
Suzaku III

New non-volatile memories and 3D integration technologies are rapidly getting wide attention, as means to realize high-speed, low-power, and/or low-cost electronic systems without relying solely upon CMOS scaling. The aim of this Workshop is to make attendees feel the potential of the two technologies that will change architectures of near future LSI-based systems. Talk topics will be selected so that they represent newest advancements, as well as system level applications, of the technologies.

8:20-8:30
Introduction
8:30-9:30 New NV Memories and its Applications
Keiichi Tsutsui, Sony Corporation
9:30-10:30 Storage Class Memory and NAND Flash Memory Hybrid Solid-State Storage System for Big-Data Application
Ken Takeuchi, Chuo University
10:30-10:45 Break
10:45-11:45 Emerging Non-Volatile Memory Technology and its Implications to Server Compute Systems
Jung H. Yoon, IBM
11:45-11:50 Additional Q&A on Morning Talks
11:50-13:40 Lunch
13:40-14:40 3D Heterogeneous System Integration and New 3D LSIs
Mitsumasa Koyanagi, Tohoku University
14:40-15:40 3-D Integration of Memory and Logic
J. Thomas Pawlowski, Micron
15:40-15:55 Break
15:55-16:55 3-D Stacking, Solving the Interconnect Bandwidth/Power/Complexity Problem
Liam Madden, Xilinx
16:55-17:00 Additional Q&A on Afternoon Talks
17:00 Conclusion

 

 


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